TRA-200/300 LED Thermal Resistance Structure Analyzer is designed to measure the thermal resistance, relative thermal resistance and junction temperature as well as the corresponding curves, which fully satisfies the requirements of JESD 51-1, MIL-STD-750D, SJ 20788-2000 and GB/T4023-1997, etc.. The system can also analyze the cumulative and differential thermal structure function automatically, which is essential for analysis and evaluation of the LEDs thermal management.
Main functions and characteristics:
1) Measure the electrical quantities of LEDs.
2) Measure the junction temperature TJ(℃), thermal resistance (℃/W), relative thermal resistance (℃/W) and optical radiation power(W) of LEDs.
3) Provide the I-V curve, transient forward voltage curve, transient junction temperature curve, cumulative thermal structure function curve and differential thermal structure function curve.
4) Measure the spectral and colorimetric quantities.
Main specifications:
1) Range of programmable constant current supply: 0.1mA～2000.0mA
2) Measurement range of forward current IF: 0.1mA～2000.0mA
3) Accuracy of forward current IF: ±(0.1%F.S.+0.1%R.D.+1DG)
4) Measurement range of forward voltage VF: 0.000 V～15.000V
5) Accuracy of forward voltage VF: ±(0.05%F.S.+0.05%R.D.+1DG)
6) Measurement current IM: 0.1mA～19.9mA
7) Heating current IH: 20mA～2000mA
Parameter
LED junction temperature and thermal resistance
The thermal resistance of LED is the main measure of the thermal conductivity of the heat flow path. The thermal resistance structure is the thermal resistance distribution on the heat flow path of the measured device. For LED device, the total heat transfer resistance is generally composed of three parts: the thermal resistance of the chip to the metal substrate, the thermal resistance of the cooling system and the thermal resistance of the cooling system to the surrounding environment.
LED thermal resistance structure analysis
The analysis software of the TRA-200/300 automatically transforms the heating or cooling curve data and obtains the transient thermal resistance curve of LED. By establishing the finite element model, the integral and differential thermal structure functions are obtained. The transverse coordinates of the peaks on the differential structural functions are the thermal resistance values of each component to the PN junction on the heat flow path. The analysis of the structure function by TRA-200 can obtain the fine thermal resistance structure of LED, so as to objectively evaluate the heat dissipation quality and the heat management level of the LED device, and provide the best verification for the heat dissipation design of the LED.
